melf pin diode 1 - 4000 mhz rev. v2 ma4p504 - 1072 1 1 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 1 features ? high power handling ? low loss / low distortion ? low thermal resistance ? surface mountable ? lead - free melf package (1072) ? halogen - free green mold compound ? rohs* compliant and 260c re - flow compatible description the ma4p504 - 1072 is a pin diode assembled in a surface mount metal electrode leadless faced (melf) ceramic package. this package is full face bonded to refractory metal plugs on both the anode and cathode. the result is a low loss pin diode with low thermal resistance due to its symmetrical thermal paths. melf pin diodes are designed specifically for high volume tape and reel assembly. their user friendly design provides for extremely easy automatic pick and place indexing and assembly. all solderable surfaces are tin plated and are compatible with all industry standard reflow and vapor phase solder processes. the ma4p504 is ideally suited for use in a series or shunt configuration where there is a high incident power present. typical applications include switches as well as attenuators from hf through uhf frequencies. the ma4p504 is manufactured using a unique passivation process which provides for a hard glass encapsulation that protects and hermetically seals the active area of the chip. part number package ma4p504 - 1072t 1500 pc. reel * restrictions on hazardous substances, european union directive 2011/65/eu. package dimensions ods 1072 ordering information 1 1. reference application note m513 for reel size information. diode cross section inches millimeters min. max. min. max. a 0.115 0.125 2.921 3.175 b 0.008 0.023 0.203 0.584 c 0.080 0.095 2.032 2.413 dimension package style 1072 inches mm a 0.093 2.36 b 0.050 1.27 c 0.060 1.52 circuit pad layout d e n o t e s c a t h o d e s o l d e r a b l e s u r f a c e s a c c b f r o n t v i e w s i d e v i e w b b c a
melf pin diode 1 - 4000 mhz rev. v2 ma4p504 - 1072 2 2 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 2 electrical specifications: t a = 25c parameter test conditions units min. typ. max. forward voltage + 50 ma v 1.0 reverse leakage current - 500 v na | - 100 | total capacitance 2 - 100 v @ 1 mhz pf 0.50 package capacitance pf 0.16 input ip3 p in = +10 dbm, spacing = 1 mhz @ 1000 mhz dbm >54 thermal resistance diode attached to infinite heatsink diode in air cw 16 48 20 51 power dissipation diode attached to infinite heatsink 3 diode in air 4 w 7.5 2.9 minority carrier lifetime i f = +10 ma, i r = - 6 ma s 1.0 series resistance +100 ma, 100 mhz 0.60 handling procedures please observe the following precautions to avoid damage: static sensitivity these electronic devices are sensitive to electrostatic discharge (esd) and can be damaged by static electricity. proper esd control techniques should be used when handling these class 1c devices. absolute maximum ratings 5,6 5. exceeding any one or combination of these limits may cause permanent damage to this device. 6. macom does not recommend sustained operation near these survivability limits. 7. values will de - rate linearly over temperature. parameter absolute maximum forward voltage 7 1.0 v reverse voltage 7 500 v operating temperature - 65c to +175c storage temperature - 65c to +200c 2. chip junction capacitance + parasitic package capacitance. 3. de - rate linearly by - 50.0 mw/c to 0 w @ +125c. 4. de - rate linearly by - 19.3 mw/c to 0 w @ +125c.
melf pin diode 1 - 4000 mhz rev. v2 ma4p504 - 1072 3 3 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 3 typical rf performance curves (50 C 4000 mhz) mounted in a series configuration input return loss output return loss insertion loss isolation -50 -40 -30 -20 -10 0 0 1 2 3 4 s11 mag (db) frequency (ghz) -0.5 -0.4 -0.3 -0.2 -0.1 0 0 1 2 3 4 il (10ma) il (50ma) il (100ma) insertion loss (db) frequency (ghz) -50 -40 -30 -20 -10 0 0 1 2 3 4 -10v -25v isolation (db) frequency (ghz) -50 -40 -30 -20 -10 0 0 1 2 3 4 s22 mag (db) frequency (ghz)
melf pin diode 1 - 4000 mhz rev. v2 ma4p504 - 1072 4 4 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 4 typical rf performance curves (50 C 4000 mhz) mounted in a shunt configuration input return loss output return loss insertion loss isolation -50 -40 -30 -20 -10 0 0 1 2 3 4 s11 mag (db) frequency (ghz) -1.60 -1.40 -1.20 -1.00 -0.80 -0.60 -0.40 -0.20 0.00 0 1 2 3 4 il (10v) insertion loss (db) frequency (ghz) -50 -40 -30 -20 -10 0 0 1 2 3 4 s22 mag (db) frequency (ghz) -35 -30 -25 -20 -15 -10 -5 0 0 1 2 3 4 10ma 50ma 100ma isolation (db) frequency (ghz)
melf pin diode 1 - 4000 mhz rev. v2 ma4p504 - 1072 5 5 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 5 series resistance vs. forward current capacitance vs. reverse voltage typical dc performance curves cleanliness and storage melf devices should be handled and stored in a clean environment. the metalized ends of the device are tin plated for greater solderability and any continuous exposure to high humidity (>80%) for extended periods of time may cause the surface to oxidize. caution should be taken when storing devices for extended intervals. mounting techniques - solder attach typical wave soldering or reflow techniques may be used to mount melf packages to circuit boards using sn63/pb37 alloy or any rohs compliant solder. for more information visit the macom website and read application note m538 . note : click links below to view datasheets of other melf packaged pin diodes and to compare them to the ma4p504 - 1072. packaged_pin_diodes and/or ma4p melf & hipax series 0 1 2 3 4 5 6 7 0 20 40 60 80 100 100 mhz rs (ohms) forward bias (ma) 0.46 0.47 0.48 0.49 0.50 0.51 0.52 0.53 0.54 0 20 40 60 80 100 100 mhz capacitance (pf) reverse bias (v)
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